Basic Info.
Packaging & Delivery
5 days (201 - 500 kg)
7 days (501 - 1000 kg)
To be negotiated ( > 1000 kg)
Product Description
Silicone Potting Compound
INI-9325
Description
Two-component silicone, platinum-curing, flowable, vulcanizes at room temperature.
Can be used for a long time in the temperature range of - 65 ° C - 200 ° C and keep its soft and elastic properties.
Application
Used for potting, encapsulating, sealing and bonding, widely used in electronic products, electricity, power supply, automotive ect. For example, used for potting of electronic components, power module and control module and controllers, junction box, solar cell assembly etc..
Can reduce stress and withstand high and low temperature impact. For the high power control module, thermal conductive silicone is used to achieve the function of heat dissipation, or outdoor protection for electronics such as LED screen.
Improve the insulation level of electronics, improve heat dissipation, and avoid the risk of electronics overheating and burning in a short time.
Features & Advantages
- High transparency
- Low viscosity, excellent flow leveling
- Food grade, FDA certificate
- Better anti-corrosion
- Better weather aging resistance
- Better insulation
- Fire proof, flame retardant
- Waterproof, moisture proof
- Anti-fouling
- Quake-proof/ withstand vibration
- Thermal conductive
- Ozone resistance
- Low shrinkage
- Can be operated in all kinds of harsh environments (Moisture, salt fog, dust, vibration, heat, deep sea, cold, etc.).
Typical properties INI-9325
| Properties Index | Test Report | |
| Before Curing | Appearance | Transparent fluid |
| Viscosity(cps) | 550±100 | |
| Operating | Mixing Ratio (By weight) | 1 :1 |
| Operating Time(25ºC /min) | 20~30 (Adjustable) | |
| Curing time (hr, basically cured) | 1~2 (Adjustable) | |
| Curing time (hr, perfectly cured) | 12 | |
| After Curing | Hardness (shore A) | 25±3 |
| Thermal conductivity [W(m·K)] | ≥0.2 | |
| Liner Conductivity [m/(m·K)] | ≤2.2×10-4 | |
| Dielectric strength(kV/mm) | ≥25 | |
| Dielectric permittivity(1.2MHz) | 3.0~3.3 | |
| Volume resistivity(Ω·cm) | ≥1.0×1016 | |
| Fire resistance | UL94-V0 | |
| Density (g/cm) | 1.08 | |
Notes: Above data are only reference values, actual data is floating and adjustable.
Operation instructions
-
Mix part A and pars B evenly with 100:3 mixing ratio.
Notes: 1) Weigh the two parts exactly by electronic weight. For example, the operation time will be shorten after adding too much catalyst.
2)Mix part A and part B evenly. Otherwise the silicon rubber will be partly solidified which will make the finished molds meet a short life and waste silicon rubber.
2.Vacuum pumping
Notes: 1) This step is not have to have, but it is best if there is one. It will discharge all air in the mixture successfully, so as to ensure that there
will be no bubbles in the finished mold.
2) This step is less than 10 minutes. Otherwise, it Will cause cross-linking reaction, and no more further steps will be available.
3.Pouring casting or Brush molding
Notes:1) For simple pattern products we suggest use pouring operation way, which will be very easy to operate and demould. Pourable silicone require low viscosity which will be easy to flow smoothly and easy to de-air.
2)For delicate pattern products we suggest use brushing operation way, which can copy the pattern exactly. Brushable silicone require high viscosity which won't be easy to flow away and easy to brush.
3)We suggest to set the mold for another 12 hours after demould before put it into large production.
Package details:1kg/5kg/20kg/25kg/200kg